Koch Chemie MICRO Cut HARD Foam Polish Pad

High-quality special sponge for removing light scratches, holograms and polishing marks using Micro Cut and Micro Cut & Finish.

Areas of application

• Removing light scratches
• Removal of holograms
• Removal of polishing marks
• Use in combination with Micro Cut and Micro Cut & Finish

Recommended use
Use with Micro Cut or Micro Cut & Finish. The low height of 25 mm reduces torsional forces, ensuring excellent handling and maximum stability. The special density of the foam material ensures long-lasting compression strength during polishing. Optimized reticulation (open cell structure) and cell count contribute to a lasting high-gloss finish and excellent hygiene factors. The milling edge allows for better adaptation to contours. The fleece, which matches the color of the polish, ensures process reliability. The compression strength and cell structure are optimized for high-solids paints.

Notice
Use only on clean, cool surfaces.