Koch Chemie MICRO Cut SOFT Foam Polishing Pad

High-quality special sponge for removing light scratches, holograms and polishing marks using Micro Cut and Micro Cut & Finish.

Areas of application

• Removal of light scratches
• Removal of holograms
• Removal of polishing marks
• Suitable for use with Micro Cut and Micro Cut & Finish
• Specially optimized for soft and sensitive paints

Recommended use
Use with a suitable polish (Micro Cut or Micro Cut & Finish). The low height of 25 mm reduces torsional forces and ensures excellent handling and maximum stability. The special density of the foam material ensures long-lasting compression strength during polishing. Optimized reticulation (open cell structure) and cell count enable a lasting high-gloss finish and offer excellent hygiene factors. The milled edge increases the pad's flexibility and facilitates adaptation to contours. The fleece, which matches the color of the polish, ensures process reliability.

Notice
Use only on clean, cool surfaces.